B. Riley FBR analyst Craig Ellis raised his price target for FormFactor (FORM) to $25 from $22 and reiterates a Buy rating on the shares. The company's foundry/logic share gain at TSMC (TSM) "seems poised for another leg higher" exiting 2019 as 7nm and 5nm volumes pick up into 2020's 5G smartphone cycle, Ellis tells investors in a research note. Further, the analyst believes rising 5G smartphone unit volumes in 2020 could "kick off another RF probe card growth cycle," similar to the early 4G years. Together, he believes these two items could provide moderate upside to FormFactor's consensus estimates.

SK hynix (HXSCL) announced that it has recently signed a memorandum of understanding with TSMC (TSM) for collaboration to produce next-generation HBM and enhance logic and HBM integration through advanced packaging technology. The company plans to proceed with the development of HBM4, or the sixth generation of the HBM family, slated to be mass produced from 2026, through this initiative. SK hynix said the collaboration between the global leader in the AI memory space and TSMC, a top global logic foundry, will lead to more innovations in HBM technology. The collaboration is also expected to enable breakthroughs in memory performance through trilateral collaboration between product design, foundry, and memory provider.

Unusual total active option classes on open include: Wrap Technologies (WRAP), AstraZeneca (AZN), JetBlue (JBLU), United Continental (UAL), Taiwan Semi (TSM), Nokia (NOK), EBay (EBAY), Maplebear Inc (CART), Airbnb (ABNB), and UnitedHealth (UNH).

Gross profit margin is expected to be between 51% and 53%; Operating profit margin is expected to be between 40% and 42%.