China Renaissance analyst Szeho Ng upgraded TSMC to Buy from Hold with a self-proclaimed Street-high NT$390 price target. The analyst sees more clarity on the company's N7 capacity tightness extending to 2020. The concern of TSMC's 5G mobile clients' possible overbooking in the first half of 2020 is mitigated by the "strong" HPC-related order ramp-up in the second half of the year, Ng tells investors in a research note. The analyst believes "favorable fund flows" into Taiwan will continue to support TSMC's share price.

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Apple (AAPL) supplier TSMC (TSM) has unveiled its A16 chip manufacturing technology featuring nanosheet transistors with "backside power rails" meant for producing its ultra-advanced 1.6nm chips by 2026, Nikkei Asia's Cheng Ting-Fang reports. TSMC says the introduction of the technology can "greatly improve logic density and performance." Reference Link

Ansys (ANSS) announced a collaboration with TSMC (TSM) on multiphysics software for TSMC's Compact Universal Photonic Engines. COUPE is a cutting-edge Silicon Photonics integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication. TSMC COUPE, along with Ansys multiphysics solutions that are integrated with Synopsys' 3DIC Compiler unified exploration-to-signoff platform, enables the next generation of silicon photonics and co-packaged optics designs for applications in AI, datacenter, cloud, and HPC communications. The work spans multiple areas, including fiber-to-chip coupling, integrated electronic-photonic chip design, power integrity verification, high-frequency electromagnetic analysis, and critical thermal management.